Centre for Trustworthy and Efficient Computing Hardware (TECH)

TIRAMISU “Training and Innovation in Reliable and Efficient Chip Design for Edge AI” is a European HORIZON MSCA Doctoral Network project. The general research objective of TIRAMISU is a practical methodology for reliable and energy-efficient Edge AI hardware backbone design and innovation management. The action will provide strong interdisciplinary training for future European engineers and researchers driving the innovation for reliable and energy-efficient Edge AI chips. The consortium is strategically designed to foster cross-disciplinary synergies, by seamlessly integrating innovation management research with the technical aspects of Edge AI design. The non-academic sector is represented by a European flagship R&D hub for nanoelectronics - IMEC, a global leader in industrial electronics and the largest semiconductor manufacturer in Germany - Infineon, a trusted automotive solutions provider - Dumarey, the worldwide leader in EDA tools development - Cadence. The academic excellence is established by the top ICT and Technology Innovation engineering universities and Europe's largest application-oriented research organisation - Fraunhofer.

Reinforcing Skills in Chips Design for Europe (RESCHIP4EU) aims to support the excellence of EU higher education in the area of embedded systems design in a holistic way, from silicon via System-on-Chip design and manufacturing to smart and safety-critical platform and application software. The holistic nature of the program is essential for innovation and provides a unique competitive edge to program graduates to design, analyse and innovate smart, green and safety-critical embedded systems in Europe. RESCHIP4EU will achieve this goal by designing and delivering a double-degree master’s programme (ISCED Level 7, 120 ECTS) in Embedded Systems Design with several specialisations related to the holistic design of embedded platforms safer, greener, smarter, and more efficient and a minor in Innovation and Entrepreneurship. The master’s programme will be designed and delivered by 9 higher education institutions from 5 different countries with the collaboration of Semi.org, the global industry association representing the electronics manufacturing and design supply chain, ST Microelectronics, a global semiconductor company, 1 innovative SME expert in delivering education program, communication and dissemination, 1 ASBL (Association internationale sans but lucrative), and EIT Digital, a pan-European organisation with experience in delivering education programmes in advanced digital skills across Europe.